Manufacturing Technology

Description

Dasan Solueta is an EMI shielding and thermal materials manufacturer with 100% integrated production from plating to adhesive coating. (Plant 1: plating process / Plant 2: adhesive coating process)
We produce conductive fabric in-house by forming a uniform conductive layer on non-conductive polyester fabric through electroless and electrolytic plating.
We hold 21 registered and pending patents related to EMI shielding, absorption and thermal management.

Roll-to-Roll Continuous Plating Line

Unwind	Pre-treatment	Pre-Plating	Main-Plating	Rewind
Polyester fabric input	Degreasing · Pickling · Catalyst	Ni · Cu (Electroless)	Cu · Ni (Electrolytic)	Conductive fabric output

14-Step Plating Process

Stage	Process Steps	Role
Pre-Plating	01 Degreasing → 02 Pickling → 03 Pre-dipping → 04 Catalyst → 05 Activation → 06 Electroless Nickel → 07 Copper Sulfate → 08 Dehydration → 09 Drying	Forms a uniform conductive layer on non-conductive polyester fabric
Main-Plating	10 Copper Sulfate → 11 Electrolytic Nickel → 12 Electroless Nickel → 13 Dehydration → 14 Drying	Adjusts properties such as resistance

Description

Electroplating : reduces metal ions using an external power source. Applicable only to conductive surfaces; fast plating speed and low cost.
Electroless Plating : deposits metal by chemical reduction without a power source. An essential step for metallizing non-conductors, with excellent uniformity.

Comparison

Item	Electroplating	Electroless
Driving Principle	External DC power	Spontaneous chemical reaction of the reducing agent in the plating bath
Applicable Materials	Conductors only	Conductors and catalyzed non-conductors (plastics · polyester)
Deposition Uniformity	Non-uniform depending on shape (excessive deposition on edges/protrusions)	Independent of substrate shape — uniform, conformal deposition over the entire surface
Characteristics	Fast plating speed · low cost	Essential for metallizing non-conductors · excellent uniformity

Overcoming Non-Conductor Limitations (Plastics / Polyester)

Step	Detail
① Etching	Selective etching creates micro-roughness on the surface — ABS: butadiene removal / Polyester: ethylene glycol removal
② Catalyst	Pd (palladium) catalyst nuclei are applied to the surface
③ Electroless Deposition	Metal ions in the electroless bath are reduced and deposited around the exposed Pd nuclei, growing uniformly over the surface

Electroless Reaction

R + H₂O → Ox + 2H⁺ + 2e⁻ (oxidation of the reducing agent)
Mⁿ⁺ + 2e⁻ → M⁰ (reduction of metal ions) or 2H⁺ + 2e⁻ → H₂↑ (hydrogen gas evolution)
At the mixed potential, oxidation and reduction rates are equal, so the reaction proceeds spontaneously without external power.

Metal Salt	Reducing Agent	Complexing Agent	pH Adjuster	Stabilizer
Nickel Sulfate (NiSO₄)	Sodium Hypophosphite (NaH₂PO₂)	Ammonium Chloride (NH₄Cl)	Ammonia (NH₃)	Thiosulfate

Description

We coat our in-house plated conductive fabric with in-house formulated PSA, achieving integrated production through to the finished product.
We design high-performance PSAs with Tg, adhesion, cohesion and heat resistance optimally tuned for each application.

Adhesive Formulation Design

Base Polymer	Functional Additives	Result
Elastomer	Tackifier · Cross-linker · Softener · Antioxidant · Filler	High-performance PSA

Coating Method

Method	Feature	Detail
Slot Die	Precision	Metered dispensing through a slot die — uniform across the web · high-precision coating
Comma	Thick film	Metered application with a comma knife — optimal for thick, uniform coating
Gravure	Thin film	Precise transfer with a fine engraved roll — stable thin-film coating
Micro-Gravure	Ultra-thin film	Uses a miniature engraved roll — ultra-thin, high-precision coating

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