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Thermal Solution

Thermal Spread Tapes

Issues Application Examples Effect
Application Areas

  • Ap chip and DDI, heat generation in OLED part
  • Cu Thermal Spread Sheet widely disperses heat from the heating part, lowers the exothermic saturation temperature, and blocks the heat from the heating part from being conducted to the OLED as much as possible
  • EMI noise shielding generated by AP chip on Main Board
  • Cu Thermal Spread Sheet + Foam Tape can be integrated
  • Thermal and EMI noise problems of IC chip
  • Relieves EMI noise shielding and heat generation generated by AP chip of Main Board
Solution

Conductive tape on top of IC Chip or SUS Cover Shield
-> EMI Noise Suppression

Thermal Spread Tapes are applied to spread the heat of the heating part to reduce the saturation temperature

GLPCB (Full Length Head Lamp)


Description
For partial heat dissipation of the LED Module FPCB applied to the front and rear lights of automobiles, the AL 1.0T is currently in use in series production. Apply this as GFPCB (FBCB + Al_GCL)
Product Detail
  • Graphene lamination technology, Binder dispersion and coating technology composite new material
  • Compared to the existing mass-produced laminated structure, unit cost competitiveness and excellent heat dissipation performance
  • Can be designed for various shapes and thicknesses required by the product
Specification
Item Unit Value Remark
Total Thickness mm 0.050 ± 0.010 Digital Upright Gauge
Thermal Conductivity (X-Y axis) W / mK Over 200 NETZSCH LFA

Thermal Pad (EV Battery)


Description
Thermal Pads for EV batteries are functional thermal interface materials applied between battery modules and cooling structures to improve heat transfer efficiency and ensure temperature uniformity.
Product Detail
  • High thermal conductivity efficiently dissipates heat generated during charging and discharging
  • Electrical insulation and chemical stability
  • Low oil bleeding minimizes contamination of surrounding areas
  • Solutions optimized for various specifications and conditions
Application
  • Thermal interface between the EV battery pack and the cooling plate — lower battery module assembly
  • CPU · GPU and power supply units in PCs
  • Automotive electronics and mounted semiconductor devices
Line Up
Grade Standard Size (mm) Thickness (mm) Thermal Conductivity (W/mK) Hardness (Shore 00)
STP-15xx 210 x 300 1.0~3.0 1.5 70
STP-30xx 210 x 300 1.0~3.0 3.0 70
STP-50xx 210 x 300 1.0~3.0 5.0 70
STP-70xx 210 x 300 1.0~3.0 7.0 70
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